BACK END PROCESSOR INPUT/OUTPUT BOARD FOR LOGIQ E9 ULTRASOUND SYSTEM by GE Healthcare

Product Overview
Key highlights
The Back End Processor Input/Output Board for the LOGIQ E9 Ultrasound System by GE Healthcare enhances the system's functionality with high-quality components, including connectors and memory EEPROM. Designed for durability and precision, it ensures reliable performance in medical imaging applications, making it essential for maintaining optimal ultrasound operations. The Back End Processor (BEP) Input/Output (I/O) Board in Ultrasound is used in LOGIQ E9 and other medical equipments as applicable. It is a kit which comprises of connectors, capacitors, inductors, resistors, IC’s, diodes, memory eeprom, LED’s, protection fuse, receiver flat panel display, transmitter, ferrite bead, IO card fab, screws, bracket bep io board, locking post kit, gaskets, foam insulator and BEPIO boot prom software. The I/O board is inserted into the BEP frame. While removing, all the I/O cables should be disconnected at the top of the BEP. The product material offers corrosion resistant, high dielectric strength, moisture resistant and strength to weight ratio. It is manufactured using high precision techniques which helps to achieve a good surface finish as well as good product consistency. Additional Features: ROHS compliant
Key Highlights
- The Back End Processor Input/Output Board is specifically designed for the LOGIQ E9 and VIVID E9 ultrasound systems, ensuring compatibility and optimal performance.
- This board comprises various components including connectors, capacitors, and ICs, which contribute to the overall reliability and functionality of the ultrasound system.
- Manufactured with high precision techniques, the board offers excellent surface finish and product consistency, enhancing the longevity of the device.
- Its robust design includes features such as corrosion resistance and moisture resistance, making it suitable for diverse clinical environments.
- The product is ROHS compliant, reflecting a commitment to environmental safety and regulatory standards.
Compatible Systems & Use Cases
This Back End Processor Input/Output Board is compatible with the following systems:
- LOGIQ E9 Ultrasound System
- VIVID E9 Ultrasound System
It is utilized in various clinical scenarios, including diagnostic imaging, obstetrics, and cardiology, where high-quality ultrasound imaging is essential.
Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | 5141000-3 |
| Compliance | ROHS Compliant |
| Material Properties | Corrosion Resistant, Moisture Resistant, High Dielectric Strength |
| Manufacturing Technique | High Precision Techniques |
| Included Components | Connectors, Capacitors, ICs, Diodes, Memory EEPROM |
Clinical and Service Value
The integration of the Back End Processor Input/Output Board into the LOGIQ E9 and VIVID E9 ultrasound systems enhances their operational capabilities. By ensuring seamless connectivity and functionality, this board plays a crucial role in maintaining high-quality imaging standards. Its robust design minimizes the risk of downtime, enabling healthcare providers to deliver timely and accurate diagnostics, which is vital in patient care.
From a maintenance perspective, the high precision manufacturing and quality materials used in the board's construction contribute to its durability and reliability. This reduces the frequency of replacements and repairs, leading to lower overall maintenance efforts. Furthermore, the board's compliance with environmental standards underscores its suitability for modern healthcare facilities, aligning with procurement policies focused on sustainability and compliance.
Additional notes
The Back End Processor (BEP) Input/Output (I/O) Board in Ultrasound is used in LOGIQ E9 and other medical equipments as applicable. It is a kit which comprises of connectors, capacitors, inductors, resistors, IC’s, diodes, memory eeprom, LED’s, protection fuse, receiver flat panel display, transmitter, ferrite bead, IO card fab, screws, bracket-bep io board, locking post kit, gaskets, foam insulator and BEPIO boot prom software. The I/O board is inserted into the BEP frame. While removing, all the I/O cables should be disconnected at the top of the BEP. The product material offers corrosion resistant, high dielectric strength, moisture resistant and strength to weight ratio. It is manufactured using high precision techniques which helps to achieve a good surface finish as well as good product consistency. Additional Features: ROHS compliant
Compatible Models
Supported systems
Technical Specifications
Key parameters
Models
LOGIQ E9, VIVID E9